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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 1/4 HMBT2222A NPN EPITAXIAL PLANAR TRANSISTOR Description The HMBT2222A is designed for general purpose amplifier and high-speed switching, medium-power switching applications. Features * High frequency current gain * High Speed Switching SOT-23 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 C Junction Temperature.................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 225 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 75 V VCEO Collector to Emitter Voltage...................................................................................... 40 V VEBO Emitter to Base Voltage.............................................................................................. 6 V IC Collector Current........................................................................................................ 600 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO ICEX IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Min. 75 40 6 35 50 75 100 40 300 Typ. Max. 10 10 10 500 1.0 1.2 2.0 300 Unit V V V nA nA nA mV V V V Test Conditions IC=10uA IC=10mA IC=10uA VCB=60V VCE=60V, VEB(OFF)=3V VEB=3V IC=380mA, IB=10mA IC=500mA, IB=50mA IC=150mA, IB=15mA IC=500mA, IB=50mA VCE=10V, IC=100uA VCE=10V, IC=1mA VCE=10V, IC=10mA VCE=10V, IC=150mA VCE=10V, IC=500mA VCB=20V, IC=20mA, f=100MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz HMBT2222A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 75 C 125 C o o Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 2/4 Current Gain & Collector Current 1000 75 C o 125 C o 25 C o 25 C o hFE hFE 100 100 hFE @ VCE=1V hFE @ VCE=10V 10 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 10000 Saturation Voltage & Collector Current VCE(sat) @ IC=10IB VCE(sat) @ IC=38IB 75 C Saturation Voltage (mV) Saturation Voltage (mV) o 1000 75 C o o 125 C 100 25 C o o 125 C 100 o 25 C 10 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 Capacitance & Reverse-Biased Voltage 100 VBE(s at) @ IC=10IB Saturation Voltage (mV) 75 C 1000 25 C o o Capacitance (pF) 10 Cob 125 C o 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse Biased Voltage (V) HMBT2222A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 3/4 Cutoff Frequency & IC 1000 250 PD-Ta VCE=20V Power Dissipation-PD (mW) 200 Cutoff Frequency (MHz).. . 150 100 100 50 10 1 10 100 1000 0 0 50 100 o 150 200 Collector Current (mA) Ambient Temperature-Ta ( C) HMBT2222A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Spec. No. : HE6822 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 4/4 A L Marking: 3 BS 1 V G 2 1P Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMBT2222A HSMC Product Specification |
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